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    • 专利摘要:
    :XBSÜIÉÄÅQÉT A headíagnaç aaisràsfimæítvšjy* ííwr a vßhififl: iflcïufiíezš hæmssixxg šåuz' cfl+l1§sš.ír:g* Åïšw hfiaaälaææzïgs asxærnïfisšy in a:>§i:}1í§:;1§:_, 3131:: hfmsing írzßïudes a. rciïectfixf and a: pïanfazr heat sínl' šsypixsiïšfinaü thefreïšvrï. 'Iïfïa:ggšamar s:i§x}:;s,t1~xia:in§fs .ínàixxfišeæ a fšrsïv zeuirfacsz* ana? s: secmzf-š. surface: for æuyßgfiirriišng; a. :zäirsuíi'šmaxrcig ñxïsï. ïightvsrniifïiixgw díøcïe aasscrnïaiišf, am! a sawcmd šíghåí zzssfafitzïíiwígje. Tha ha-:acšlzaxïrgë vasfssxztmhliëß is 'adaptefi to :fnfxiti a hi hszfanïzaxïd s: qm-v bean: :mä ïirn: inszxcšišßfxzxq: assainfrsigï' äs çaï>:11p}.&ite!}== hísiëziïfiii, by tlfiaï' gjašanaïr haaï sänk. struizmïffa. Fšg; íltwfpzfítfilícaïíxxzz: fi
    公开号:SE539975C2
    申请号:SE1351031
    申请日:2012-02-09
    公开日:2018-02-13
    发明作者:Marley Michael；Kolstee Todd；Dipenti Timothy；Smith Ryan
    申请人:
    IPC主号:
    专利说明:

    i-feadiamp Assembiy with Pianar Heat Sinir; Structure Brief Üescriptien of the Drawings Figure t is a first ernpedirnent of a headiantp assembiv with a pianar heat sinkstructure.
    Figure 2 is a perspective view of a first surface of the heat sink structure ef theheadiarnp of Figure t.
    Figure 3 is a perspective view of a second surface ef the heat sink structure ofthe headiamp ef Figure t.
    Figure 4 is an expieded view ef heat sink. structure 25 with first surface 35 facingup.
    Figure 5 is an expioded view of second surface 35 of heat sink structure 25.Figure 5 iiiustrates first surface ef heat sink structure in an assernpiedconfiguration.
    Figure 7 iiiustrates second surface of heat sink structure in an assernpiedconfiguration.
    Figures ha and Sh iiiustrate first and second refiecter portions of the headiantpasserneiy ef Figure t.
    Figures Qa and Qb iiiustrate heat sink structure is pesitioned between first and second refiecter pertiens.
    Figure 10 is an exptoded view oi the headiantp assernhiy oi Figure 1.
    Figure 'i 1 is hack view oi the headiamp assembly oi Figure 1.
    Figure 12 is a second ernhodiment oi a headiarhp assembiy with a pianar heatsink structure.
    Figure 13 is a perspective view oi a iirst suriace oi the heat sihk structure oi theheadiarhp oi Figure 12.
    Figure 14 is a perspective view oi a second surface oi the heat sink structure oithe headiarnp oi Figure 12.
    Figure 15 is an expioded view oi the heat sink structure with the first suriaceiacing up.
    Figure 16 is an expioded view oi the second suriace oi the heat sink structure oithe headiamp oi Figure 12.
    Figure 1 itiustrates iirst surface oi heat sihk structure oi the headtarnp oi Figure12 in an assemhied configuration.
    Figure 18 iiiustrates second surface oi heat sink structure oi the headiarhp oiFigure 12 in ah assentoied ccniiguration.
    Figures 19a and tub iiiustrate iirst and second reiieotor portions oi the headiarnpassembiy oi Figure 12.
    Figures 20a and 20h iiiustrate the heat sihk structure positioned between iirstand second reiiector portions.
    Figure 21 is an expicded view oi the headiamp assemhiy oi Figure 12.
    Figure 22 is hack view oi the headiamp assemoiy oi Figure 12.
    Figures 23a and 23b are aiterrtate embodimehts oi the heat sink structure.
    Figure 24a is a front view oi a ouoket assemoiy for attaohing a headiarnpassembiy to a vehicie.
    Figure 24th is an additionai view of the bucket assemoiy of Figure 24a.Figure 24:: iitustrates a back view of the bucket assembly of Figure 24a.Figure 24d is a cross-sections! view of the oucket assernoiy with headtampassembty thereirr.
    Detaited Description As shown in Figure t, a first embodirnent of a headtamp assembty 10 for avehioie inciudes a 'ï-in round housing 15 for coupiing headtamp assembiy "to tothe vehicte, first and second refiector portions 2G and 21 and a heat sinkstructure 25, which is a pianar body that bisects housing into upper and towerareas, 27 and 28. Heat sink structure 25 supports tight emttting diodeassemiaties and a cirouit board, as witi ioe discussed in detaii ioeiow. i-ieadiampassemoty inciudes a tens 30. Lens 3G may be formed of a hard-coatedpotycarborrate that is giued to housing 15 using a two component urethane. inone embodirnent, tens 30 inciudes a copper wire heating eternent for meiting snow or ice.
    One embodiment of heat sink structure 25 is iitustrated in figures 2-5. inparticuiar, heat sink structure 25 inctudes a first surface 35 (figure 2) and asecond surface 36 (figure 3). t-ieat sink structure 25 aiso tnciudes a housing abutting edge 4G which is made up of first and second side edges, 42 and 43, first and second curved edges, 47 and 48, and back edge 49. Side edges 42and 43 aiso include aiignrnent ribs 50 for aiigning heat sink structure 25 withinhousing 15.
    Planar heat sink 25 also includes a suhstantialiy straight edge 51,. which ispositioned near tens 35 in neadiamp assembly 15. As iilustrated in Figure 3, firstsurface 35 includes a first tight emitting diode receiving portion 55, which maytake the form of an indented area sized to receive a light emitting diode.Aiignment posts, 57 and 58, may be formed in first light emitting diode receivingportion 55 for aiigning with datum features in a first tight ernitting diode assembly65. Thus, first tight emitting diode assembiy 65 may be accurateiy located onheat sink structure 25. in addition, first tight emitting diode reoeiving portion 55has holes 58 and 59 formed therein for accepting fasteners, 75 and 71, used forseouring first tight ernitting diode assembly 55 to heat sink structure 25 in thesame piane as first surface 35. First surface 35 aiso includes fastener receivingchanneis 73 and 74 for facilitating the attachment of screws for joining heat sinkstructure 25 and housing 15. A front angied portion 75 of heat sink structure 25is located near substantially straight edge 51. Upstanding supports 77 and 78are also formed at each side of front angled portion 75 for supporting firstreflector portion 20, as will be described in detail below. Heat sink structure 25also inciudes apertures 79 and 50 for receiving tasteners, generaliy indicated at81, for securing first and second reflector portions, 20 and 21, to heat sinkstructure 25. An additional aperture 82 is iocated adjacent to back edge 49 of housing abutting edge 40 of heat sink structure 25. Aperture 82 is adapted to receive altgnment projections 83 and 84 of first and second reflector portions, 2Gand 21, for facilitating the pcsitioning of first and second reflector portions, 20and 21, on heat stnk structure 25.
    As iltustrated in Figure 3, the second surface 36 of heat sink structure 25includes a second light emitting diode receiving portion 85 and a ctrcuit boardrecelving portion 67 formed therein. Second tight emitting diode receiving portion85 includes alignment posts, 86 and 89, formed therein for atignlng with datumfeatures in a second tight ernitting diode assembly 90. Apertures 91 and 92 arealso formed therein for accepting fasteners, 93 and 94, used for securing secondEight ernitting diode assembly 90 to heat sink structure 25 in the same ptane assecond surface 36, in one ernhodirnent, circuit board receiving portion 87 ispositioned near suhstantialty straight edge 51 of heat sinlt structure 25 and tightemitting diode receiving portion 65 is positioned near the housing abutttng edge40 of the heat sink structure. Thus, second tight ernitting diode receiving portion65 and clrcuit board reoeiving portion 67 are adapted to support second tightemitttng diode 95 and a circuit board 106 in a same plane as second surface 36.
    Figure 4 is an expioded view of heat stnk structure 25 with first surface 35facing up. First fight emitting diode assembly 65 is shown above first lightemittlng diode receiving portion 55. Atignment posts 57 and 55 correspond toapertures in first tight ernitttng diode assembly 65. in addition, hoies 68 and 56formed within first tight emitting diode receiving portion 55 aiign with fasteneralignment features 102 and 163 such that fasteners 70 and 71 may secure first tight emitting diode assembly 65 to heat sänk structure 25. in the emhodirnent shown, first light emitting diode assembly 55 is a 1x2 Altiion LED Assemblymanufaotured by Phiiips Lumiied. A thermaiiy conduotive compound may bepositioned betyveen heat sink structure 25 and first tight emitting diode assembfy55. The thermaiiy oonductive cornpound may be a material such as thermaigrease, phase change material, thermai epoxy, or thermal tape. An elongatedopening 105 is aiso formed within first surface 35 of heat sink structure 25.Elongated opening 105 is formed adiaoent to first tight ernitting diode receivingportion 55 along front angled portion 75 of first surface 35 and is adapted toreceive thermal stampings 108 from a combined buss bar and light blinderassembly 110.
    Combined buss bar and Eight blinder assembly 110 includes a buss barportion 111 and a tight biinder portion 112.. Bus bar portion 111 includes thermalstampings 158 that contact first light emitting diode assembly 55 at a first ende115 and extend through elongated opening 105 of heat sänk structure 25 at asecond ends 117. Second ends 114 contact a oircuit board 125 at openings 128in circuit board 125, thereby forming an electricai connection between first lightemitting diode assembly 55 and heat sink structure 25. Second enda 114 ofbuss bar portion 111 may be soldered to circuit board 125 and first ende 115 ofbuss bar portion 111 may be soldered to first light emitting diode assembly 55.An overmoid 127 is positioned over thermai stampings 158 to insuiate thermaistampings from heat sink structure 25, which is formed of a oonductive materiai.Qvermoid 127 may be formed of a material suitable for high temperature appiications, such as a giass filled nylon material. As noted above, first ends 115 and second ends 117 are left uncovered to provide the necessary electricalContacts. in one embodirnent, thermal stampings 108 are made of tln piatecibrass.
    Light biinder portion 112 of heat sink structure 25 may be connected tooverrnoid 127 with an integrai extension 130. in one embociiment, light blinderportion 112 blocks light from approximateiy (ie. glare zone) in a photometricpattern. Light bilnder portion 112 may include bottom proiections 133 forContacting first tight emitting diode assembiy 65. Therefore, tight blinder portion112 is positioned perpendicuiar to first light emitting diode assembly 65 as shownin figure 6.
    Figure 5 is an expioded view of second surface 36 of heat sink structure25 with second light emitting diode 95 and a Circuit board 125 positioned abovesecond light emitting diode receiving portion 85 and circuit board receivingportion 07, respectively. in one ernbodiment, jumper wires 140 used to make aneiectricai connection beat/een second light emitting diode 05 and a circuit board125. Aiternativeiy, a ribbon cable, buss bar, or other suitable device may beused to make an electrical connection.
    As iiiustrated, circuit board receiving portion 87 includes elongatedopening 105, which extencis through heat sink structure 25 from fist surface 35.Second ends 117 of thermal stampings 108 extend through eiongated opening105 such that second ende 117 contact circuit board 100 at that contact first tightemitting diode assembly 65 at a first ends 115 and extend through eiongated opening 105 of heat sink structure 25 at a second ende 117. in the embodiment shown, second Eight emitting diode assembiy 95 is a 1x4 Aitiion LED Assembiymanufactured by Phiiips Lumiied.
    Figures 5 and 7 iiiustrate first and second surfaces, 35 and 36, of heatsink structure 25 in an assernbied configuration. in figure 6, first surface 35 isshown with first Eight ernitting diode assembiy 65 positioned within the first tighternitting diode receiving portion 55. in addition, combined buss bar and tightbiinder assembiy 110 is shown with buss bar portion 111 extending into andthrough eiongated opening “E05 formed in first surface 35 and Eight biinder portion112 is perpendicuiar to first fight emitting diode assembiy 65 such that tightemitted in the 10U to QOLE range is shieided.
    Figure 7 iiiustrates second surface 36 having circuit board too positionedwithin circuit board receiving portion 87. Although not shown, circuit board 160inciudes eiectricai components on each side thereof. En one embodirnent athermai materiai, such as a GAP pad, is used on a bottom side of circuit board100 in order to improve thermai contact between the eiectricai components andheat sink structure 25. in the embodiment shown in Figure Y, jumper wires 149are shown to provide an eiectricai connection between second Eight emittingdiode assembiy 90 and circuit board 100.
    As iiiustrated in Figures Sa and Sh, headiamp assembiy 1G inciudes firstand second refiector portions, 2G and 21. First refiector portion 2G is a Eow beamrefiector and second refiectcr portion 21 is a high beam refiector. Both first andsecond refiector portions, 20 and 21, are moided and metaiized. En addition, each of first and second refiector portions, 2G and 21, have a cornpiex refiector optic design. The compiex refiector optioai design tnciudes rnuitipie intersectingsegrnents. The segments intersect at points that may oe profound and visibte orhiended to form a uniform singie surface. First refiector portion 28 inciudes aheat sink aoutting edge 142 having an aiignment projections 83 for fitting withinaperture 82 formed in first surface 35 of heat sink structure 25. Apertures (notshown) formed on heat sinir ahutting edge 142 of first refiector portion 2G atignwith apertures 79 and 80 of heat sink structure 25 for receiving fasteners 81 forsecuring first refiector portion 20 to heat sink structure 25. First refiector portion20 aiso inciudes projections, one of which is indicated at 143, formed on heatsink ahutting edge 142 for contacting upstanding supports 77 and 78 formed onfirst surface 35 of heat sink structure 25. Simiiariy, second refiector portion 21inciudes a heat sink aoutting edge 145 having aiignment protection 84 for ftttingwithin aperture 82 formed in second surface 38 of heat sink structure 25.Additionai apertures, 148 and 148, formed within heat sink ahutting edge 145 ofsecond retiector portion 21 aitgn with apertures 79 and 80 of heat sink structure25 for reoeiving fasteners 81 for securtng second refiector portion 21 to heat sänkstructure 25.
    When assemhied, as iiiustrated in Figures Qa and Qh, heat sänk structure25 is positicned between first and second refieotor portions, 2G and 21, therapycreating an upper area 27 and a tower area 28. i-ieat sink structure prevents tightfrom upper area 2" area from impinging on second refiector portion 21 andprevents fight from tower area 28 from tmpinging on first refiector portion 20.
    Heat sink aputting edge 143 of second reftector portion 21 contacts heat sink aiong heat sink aioutting edge 143. i-iowever, heat sink aoutting edge 142 of firstreiiector portion 20 does not contact heat sink structure 25 at front angted portion75 thereof. Thus, projections 143 of first reiiector portion 2G contact upstandingsupports 77 and 78 formed on first surface 35 of heat sänk structure 25 such thata contact point is provided between front angied portion '75 ct heat sink structure25 first refiectcr portion 20. Lipstanding supports 77 and 78 provide stabiiity andprevent vibration of refiector portion 2G. Front angied portion 75 ot heat sinkstructure 25 serves to aiiow iight refiected first retiector portion 2G to fiiiforeground photometric requirements.
    Figure 10 is an expioded view of headiamp assembiy 1G for iiiustrating themanner in which heat sink structure 25 and first and second refiector sections, 20and 21, are attached to housing 15. As discussed with respect to Figures 3 and4, heat sink structure 25 inciudes side edges 42 and 43 having aiignment rios 5Gfor aiigning heat sink structure 25 within housing 15. Housing 15 inciudes anaiignment member, such as an aiignment rio reoeiving channei, formed on eachend thereof. Thereicre, aiignment rihs 50 cooperate with aiignments members ofhousing 15 to ensure that heat sink structure 25 is in a proper position uponinsertion into housing 15. Housing 15 inciudes hosses formed therein foraiigning with fastener reoeiving channeis 73 and 74 of heat sink structure 25 andfor receiving fasteners, generaiiy indicated at 155, for securing heat sinkstructure 25 and housing 15. A iiat surface 157 is formed on inner surface 150of housing for contacting hack edge 49 of heat sink structure. A therrnaiiy conductive rnateriai, such as therrnai grease, phase change rnateriai, therrnai 1G epoxy. or thermai tape, may be placed between back edge 46 of heat sinkstructure 25 and flat surface 157 of housing 15. An opening 165 for e. wire seal176 is also formed within housing 15 to allow wires to exil; housing 15. Housing15 may be formed of die-east aluminum that is anodized black for improvedthermai emissivity. Housing 15 also functions as a heat slnk for first and secondlight emitting diode assemblies and circuit board 166.
    As iiiustrated in Figure 11, a back surface 172 of housing 15 may includefins 175 for providing increased surface area and greater heat dissipation.Housing 15 also functions as a heat sink for first and second light ernitting diodeassemblies, 65 and 90, and circuit board 166. Housing also serves to provideenvironmental protection for first and second light emitting diode assemblies, 65and 96, circuit board 160, and any wiring components. A Gore-Tex patch 173 isplaced within an opening in housing 15 to prevent water from entering headiampassembly 16 while allowing water vapor to escape. Housing 15 also provides amounting interface for attaching headlamp assembly 16 to a vehicle. in general,headlamp assembly 16 is rnounted to a vehicle through the use of bucketassemblies, as is known in the art.
    Headlamp assembly 10 is adapted to emit both high and low beams. Alow bearn pattern is emitted when first fight emitting diode assembly 65 isiiiuminated. A high beam pattern is emitted from headiamp assembly when bothfirst light erriitting diode assembly 65 and second light emitting diode assembly 96 are sirnuitaneously iliuminated. 11 A second emioodiment of is generatiy indicated at 210 in Figure 12.i-ieadtamp assernhiy 210 5x7 housing 215 for coupiing headiamp assembiy 210to the vehicte, first and second refiector portions 220 and 221; and a pianar heatsink structure 225 that oisects housing into upper and tower areas, 227 and 228.Planar heat sink structure 225 supports tight emitting diode assemoiies and acircuit board, as wiii be discussed in detait betow. Headtamp assembiy 210inctudes a tens 230. Lens 230 may be formed of a hard-coated poiycarhonatethat is gtued to housing 215 using a two component urethane. Opticai elements231 are formed in tens 230 around the perimeter of tens 230 to diffusa tight in the100 -90tJ giare zone. in one embodiment, tens 230 inciudes a copper wireheating eiement for metting snow or ice. i-ieadiamp assemhiy 210 is designedfor rnechanicai aiming by the use of aiming pads (not shown) on an exteriorsurface of tens 230. A rnechanicai aimed iamp is generaiiy designed to meetspecific photometric requirements.
    One embodirnent of heat sink structure 225 is iiiustrated in figures 13-15.in particuiar, heat sink structure 225 inciudes a first surface 235 (figure 13) and asecond surface 235 (figure 14). Heat sink structure 225 aiso inctudes a housingahutting edge 240 which is made up of first and second side edges, 242 and 243,first and second ourved edges, 247 and 243, and back edge 243. Side edges242 and 243 aiso inctude aiignment stots 250 for aiigning heat sink structure 225within housing 215. i-ieat sini< structure 225 aiso inciudes a substantiaity straight edge 251, which is positioned near tens 230 in headiamp assemhty 210. 12 As iifustrated in Figure 18, first surface 235 inciudes a first fight ernittingdiode receiving portion 255, which may take the form of an indented area sizedto receive a fight emitting diode. Atignrnent posts, 257 and 258, may be formedin first fight emitting dicde receiving portion 255 for aiigning with datum featuresin a first tight emitting diode assembiy 285. Thus, first fight emitting diodeassembly 285 may be accurateiy focated on heat sink structure 225. fn addition,first fight emitting diode receiving portion 255 has hofes 288 and 289 formedtherein for accepting iasteners, 270 and 271, used for securing first fight emittingdiode assembfy 285 to heat sink structure 225 in the same piane as first surface235. A BUSS bar receiving portion 272 is afso formed in first surface 235, as wifibe described in more detaii below. First surface 235 aiso inciudes fastenerreceiving channets 273 and 274 for faciiitating the attachment of screws forjoining heat sink structure 225 and housing 215. Front upstanding bosses 277and 278 are aiso formed adjaoent to each of first and second side edges 242 and243 for receiving fasteners for attaching first reffector portion 220 to heat sinkstructure 225, as wifi be described in detaii betcw. Heat sink structure 225 afsoinciudes rear upstanding bosses 279 and 288 for receiving tasteners for securingfirst and second refiector portions 220 and 221 to heat sink structure 225. Wirechanneis 281 are aiso formed within heat sink structure for providing a passagefor wires 282.
    As ifiustrated in Figure 14, second surface 238 of heat sink structure 225includes a second tight ernitting diode receiving portion 285 and a circuit board receiving portion 287 formed therein. in the ernbodiment shown, second fight 13 emitiing diode receiving portion 255 is ccmposed of upstanding waiis forsurrounding a second tight emitting diode 290, which is positioned within circuitboard receiving portion 287. Second tight emitting diode receiving portion 255inciudes aiignrnent posts, 255 and 255, formed therein for aiigning with datumfeatures in second tight emitting dicde assembiy 290. Apertures 251 and 202 areaiso formed therein for accepting faster/ters, 293 and 294, used for securingsecond tight emitting diode assemhiy 290 to heat sink structure 225 in the samepiano as second surface 235. Second surface 235 of heat sink structure 225aiso inciudes apertures 255-255 formed adjacent to housing ahutting edge 240for faciiitating the attachment of second refiector portion 221 to heat sinkstructure 225.
    Figure 15 is an expioded view of heat sink structure 225 with first surface235 facing up. First tight emitting diode assemciy 255 is shown above first Eighternitting diode receiving portion 255. Aiignment posts 257 and 255 correspond toapertures in first tight emitting diode assembiy 255. in addition, notes 255 and259 formed within first iight emitting diode receiving portion 255 are adapted toreceive fasteners 270 and 271 for seouring first fight emitting diode assemoiy 255to heat sink structure 225. in the emoodiment shown, first tight emitting diodeassemhiy 255 is a 1x4 Aitiion LED Assembiy manufactured by Phiiips Lumiied. Athermaiiy conductive compound may be positioned between heat sink structure225 and first fight emitting dicde assembly 255. The thermaiiy conductivecompound may be a materiai such as thermai grease, phase change materiai, thermai epoxy, or thermai tape. An eiongated opening 305 is aiso formed 14 through heat sink structure 225, as shown in Figure 14. Eiongated opening 355is formed adjacent to BUSS bar receiving portion 2372 and is adapted to receivethermai stampings 333 ircrn BUSS bar 31 t).
    BUSS bar 310 inctudes thermai starnpings 358 that contact iirst tightemitting diode assembiy 255 at a iirst ends 315 and extend through eiongatedopening 355 ot heat sink structure 225 at: a second ends 317. Second ende 31 'ïcontact a circuit board 325 through etongated opening 305, thereby iorming aneiectricai connection between iirst tight ernitting diode assembly 255 and heatsink structure 225. First ende 315 oi buss bar 31 G may be soidered to tirst tighternitting diode assembly 265. An overmoid 327 is positioned over thermatstampings 353 to insuiate thermat stampings from heat sink structure 225, whichis formed oi a conductive materiai. As noted above, iirst ends 315 and secondends 317 are tett uncovered to provide the necessary eiectricai contacts. in oneembodiment, thermat stampings 308 are made oi tin piated brass.
    Figure 16 is an expioded view oi second surface 235 ot heat sink structure225 with second tight emitting diode 290 and a circuit board 325 positionedabove second tight emitting diode reoeiving portion 285 and circuit boardreceiving portion 287, respectiveiy. in one embodiment, a iiat ribbon cabie 340is used to make an eiectricai connection between second tight emitting diode 295and Circuit board 325. Aiternativeiy, jumper wires, a buss bar, or other suitabiedevice may be used to make an eiectricai connection. in the embodirnentshown, second tight emítting dicde assernbiy 290 is a 1><4 Aitiion LED Assembiy manuiactured by Phittps Lurniied.
    Figures 17 and 18 iiiustrate first and second surfaces, 235 and 235, ofheat sänk structure 225 in an asssmbied configuration. in figure 17, first surface235 is shown with first tight emitting diode assembiy 255 positioned within thefirst iight emitting diode receiving portion 255. in addition, buss bar 310 is shownwith overmoid 327 iitted within BUSS bar recsiving portion 272. Wires 282extend from first fight emitting diode assembiy 255 through wire channeis 281formed in first surface 235 of heat sink structure 225.
    Figure 18 iiiustrates second surface 236 having circuit board 325positioned within circuit board receiving portion 237. Aithough not shown, circuitboard 325 inciudes eiectricai components on each side thereof. in oneembodiment a thermai rnateriai, such as a GAF pad, is used on a bottom side ofcircuit board 325 in order to improve thermai contact between the eiectricaicomponents and heat sink structure 225. in the embodirnent shown in Figure 13,a fiat ribbon cabie 340 is used to provide an eiectricai connection betweensecond fight emitting diode assembiy 230 and cirouit board 325.
    As iiiustrated in Figures “i9a and 19b, headiamp assembiy 210 inciudssfirst and second refiector portions 226 and 221. First refiector portion 220 is aiow beam refiector and second reiiector portion 221 is a high beam refiector.Both first and second reiiector portions 223 and 221 are moided and metaiized.in addition, each of first and second reiiector portions 223 and 221 have acompiex retiector optic design. First refiector portion 223 inciudes a heat sänkabutting edge 342 having apertures (not shown) formed therein for aiigning with upstanding bosses 277-280 of first surface 235 of heat sink structure 225. 16 Fasteners 251 are used to secure first refiector portion 225 to heat sink structure225. Sirnilariy, second retiector portion 221 includes a heat sink abutting edge345 having apertures 347-355 formed therein tor aiigning with apertures 295-255formed in second surface 235 of heat sink structure 225. Fasteners 281 extendthrough the apertures to secure second retiector portion 221 to heat slnkstructure 225.
    When assembled, as iliustrated in Figures 25a and 255, heat sinkstructure 225 is positioned between tirst and second reflector portions 225 and221, thereby creating an upper area 227 and a lower area 223 in headlarnpassembly 215. l-ieat sink structure 225 prevents tight from upper area 227 fromirnpinging on second retlector portion 221 and prevents tight from tower area 225from irnpinging on first refiector portion 225.
    Heat sink abutting edge 345 oi second reiiector portion 221 contacts heatsink structure 225 to facilitate fastening of second refiector portion 221 to tirstsurface 235 of heat sink structure 225. i-iowever, heat sink abutting edge 342 otfirst refiector portion 225 does not contact heat sink due to upstanding bcsses277-255, which are formed on first surface 235 ct heat sink structure 225.
    Figure 21 is an expioded view of headianip assembly 215 for iiiustratingthe manner in which heat sink structure 225 and first and second refiector section225 and 221 are attached to housing 215. As discussed with respect to Figures13 and 14, heat sink structure 225 inciudes side edges 242 and 243 havingaiignrnent slots 255 tor aiigning heat sink structure 225 within housing 215.
    Housing 15 includes an aiignrnent member, such as an aiignment protection 355, 17 formed on each end thereof. Therefore, aiignment sicts 250 cooperate withaiignments members 335 of housing 215 to ensure that heat sink structure 225 isin a proper position upon insertion into housing 215. Housing 215 inciudesbosses formed therein, one of which is indicated at 360, for aiigning with fastenerreceiving channeis 273 and 274 of heat sink structure 225 and for receivingfasteners, generaiiy indicated at 365, for securing heat sink structure 225 tohousing 215. A thermaiiy conductive materiai, such as thermai grease, phasechange materiai, thermai epoxy, or thermai tape, may be piaced heat sinkstructure 225 and an inner surface 368 of housing 15. An opening 375 for a wireseai is aiso formed within housing 215 to aiiow wires 282 to exit housing 215.Housing 215 may be formed of die-east aiurninurn that is anodized biack forimproved thermai emissivity. Housing 215 aiso functions as a heat sänk for firstand second tight emitting diode assembiies and circuit board 325.
    As iiiustrated in Figure 22, housing 215 includes a Gore-Tex patch 330 ispiaced within an opening in housing 215 to prevent water from enteringheadiarnp assembly 21 O white aiiowing water vapor to escape. Housing 215sen/es to provide environmentai protection for first and second fight emittingdiode assembiies, 265 and 296, circuit board 325, and any wiring components.Housing 215 aisc provides a rnounting interface for attaching headiampassembiy 21 O to a vehicie.
    As discussed above, headiamp 210 emits both a high beam and a iow beam. The iow beam function uses oniy first refiector portion and first tight 18 emitting diode assembly. The high beam function uses both lirst and secondreilector portion and both tirst and second light emitting dlode assemblies.Figures 23a and 23b illustrate additional embodiment ot the heat sinkstructure tor a Win round headlamp and a Ex in headlamp. Figure 23aiilustrates a heat sänk 400 having a second side 405. Light emitting diodereceiving portion 407 is formed therein. The rernainder ot second surface ishoilowed out to allow tor various circuit board contigurations. Once a circuitboard is selected tor heat sink 400, second side ot heat sänk is tilled in tosurround the circuit board. Simiiariy, tigure 23a iliustrates a heat slnk 500 tor a5x7 headlamp assembly. Second surtace 505 is iliustrated with light emittlngdiode receiving portion formed therein. Once a circuit board configuration ischosen, the area of second side 505 surrounding the circuit board is filled in.Figures 24a-24d iilustrate a mounting bucket assembly 600 tor headiampassembly 10. Figure 24a is a front view ot buchet assembly 000 having aretention spring 605, a mounting ring 008 in which lamp assembly sits, a verticalaiming screw 010 and a horizontal alming screw 612. Figure 24b is a view ot thebucket assembly 600 ot Figure 24a. A bezei or retaining ring 615 is included toretain lamp assembly 10 in bucket assembly 800. Apertures 020 are tormed inretaining ring G15 to allow access to vertical airning screw 510 and horizontalaiming screw 612. Figure 240 illustrates a back view ot bucket assembly 600.Threaded tasteners 525 are provided tor attachlng headiamp assembly 10 andbucket assembly 600 to a vehicle. Figure 24d is a cross-sections! view ot bucket assembly 500 retaining headlamp assembly 10 therein. Although shown with 19 respect to the "ï-in round headlarnp assembly, it should be understood that acorresponding bucket assembly is avaiiabie for the 5x7 headiamp assembly.Although the embodiments of the invention herein has been describedwith reference to particular embodirnents, it is to be understood that theseembodiments are rnereiy iitustrative ot the principles and applications of thepresent invention. For example, the headiarnp assembly may include a housingof a 4x6 configuration. lt is therefore to be understoed that numerousmodiiioations may be made to the iliustrative embodiments and that otherarrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended ciairns.
    权利要求:
    Claims (83)
    [1] 1. We ciairn:f. A headiamp assembly for a vehicle, comprising: a housing for coupiing the headiamp assembly to a vehicle, the housingincluding a reflector; a pianar heat sink structure having a first surface and a second surface; a oircuit board supported by the heat sink; a first light emitting diode assembly supported by the first surface of theheat sink structure and a second light emitting diode assembly supported by thesecond surface of the heat sink structure, each of the first and second tightemitting diode assembiies being eiectricaily connected to the circuit board; and wherein the headlamp assembly is adapted to ernit a high beam and a lowbeam and wherein the headlarnp assembly is compieteiy bisected by the pianar heat sink structure.
    [2] 2. The headlarnp assembly of claim 'Lwherein the heat sänk structure is rernovabiy attached to the housing.
    [3] 3. The headlamp assembly of claim 2, wherein the heat sink structure inoiudes ahousing abutting edge and a substantiaiiy straight edge, the housing abuttingedge being adapted to abut an inner surface of the housing such that the housingis completely biseoted into first and second areas by the pianar heat sink SÉYUCÉU fâ.
    [4] 4. The headlamp assembly of claim 3, wherein the housing abutting edge of theheat sink structure includes aiignment ribs positioned thereon for faciiitating theattachment of the heat sink structure to the housing.
    [5] 5. "the headiamp assembly of claim t wherein the first surface of the heat sinkstructure includes a light ernitting diode receiving portion formed therein to 21 support the first tight emitting diode assemhiy in a same piano as the first surface.
    [6] 6. The headiamp assernbiy of ciaini 5, wherein the second surface of the heatsink structure inciudes a second iight emitting diode receiving portion formedtherein and a circuit board receiving portion formed therein to support the secondtight emitting diode assemoiy and the circuit board in a same piane as the second surface.
    [7] 7. The headiarnp assemoiy of ciairn 6, wherein iiiumination of the first tightemitting diode assernhiy resuits in a iow oeam, and wherein itiumination of boththe first tight emitting diode assernoty and the second tight ernitting diodeassernoiy resuits in a high oeam.
    [8] 8. The headiamp assembiy of oiairn t wherein the heat sini: structure is made ofanodized biaok die-east aturninuni to iaciiitate thermat ernissivity. s.
    [9] 9. The headiarnp assenihiy of ciairn o wherein the first and second tight emittingdiode receiving portions inciude aiignment posts formed therein for positioningthe first and second tight emitting diode assemhiies on the heat sink structure.
    [10] 10. The headiamp assernbiy of otaim 9 wherein the first and second tight emittingdiede assembiies are further secured to the heat sink structure with fasteners. ft.
    [11] 11. The headiarnp assemoiy of oiaim 'i wherein a thermatiy conductivecompound is positioned between the heat sink structure and the first tightemitting diode assembiy and between the heat sänk structure and the second tight ernitting diode assemhiy.
    [12] 12. The headiarnp assembly of ciaim t further comprising a combined BUSS harand tight oiinder assemoiy positioned on the first surface of the heat sänk 22 structure for eiectricaiiy connecting the circuit board to the first tight emittingdiode assembiy and for biocking a portion of Eight from the first Eight emittingdiode assernbiy.
    [13] 13. The headiamp assembiy of ciaim 12 wherein the combined BUSS bar andtight biinder assembiy is over-moided with giass fiiied nylon.
    [14] 14. The headiamp assembiy of ciaim 12 wherein the combined BUSS bar andiight biinder assembiy biocks tight from tott) to 90°U in photometric pattern.
    [15] 15. A heat sink structure for use in a headiarnp assembly with a housing, arefiector, a circuit board and first and second Eight emitting diodes, the heat sink structure comprising: a pianar body having a housing abutting edge and a substantiaiiy straightedge, the housing abutting edge being adapted to abut an inner surface of thehousing and adapted to bisect the housing into first and second sections; a first surface of the pianar body having a first iight emitting diodereceiving portion formed therein to support the first Eight emitting diode in a same piane as the first surface; a second pianar surface of the pianar body having a second Eight emittingdiode receiving portion and a circuit board receiving portion formed therein tosupport the second Eight emitting diode and the Circuit board in a same piane as the second surface.
    [16] 16. The heat sink structure of ciaim 15, wherein the housing abutting edge of thepianar body inciudes aiignment ribs positioned thereon for faciiitating attachment of the heat sink structure to the housing. 23
    [17] 17. The heat sink structure of ciaint 15 wherein the heat sink structure is made ofanodized biack die-east aiuminum to faciiitate therrriai emissivity.
    [18] 18. The heat sink structure of ciaim 15 wherein the first and second fight emittingdiode reoeiving portions inciude aiignment posts formed therein for positioningthe first and second iight emitting diodes on the pianar body.
    [19] 19. The heat sink structure of ciaim 18 wherein the first and second iight emittingciiode receiving portions inciude apertures for receiving fasteners for furthersecuring the first and second fight ernitting diodes on the pianar body. 2G.
    [20] 20. A headiarnp assernbiy for a vehicie, comprising: a housing for coupiing the headianfp assernbiy to a vehicie, the housinginciuding an inner surface defined by a refiector; a pianar heat sink structure having a first surface, a second surface, ahousing abutting edge and a substantiaiiy straight edge, the housing abuttingedge being adapted to abut an inner surface of the housing, wherein the heatsink structure is adapted to cornpieteiy separate the housing into first and secondsections; a circuit board supported by the second surface of the heat sink structure,the circuit board being positioned near the substantiaiiy straight edge of the heatsinh structure; a first fight emitting diode being supported by the first surface of the heatsink structure and being eiectricaiiy connected to the circuit board, the first Eighternitting diode iying in substantiaiiy the same piane as the first surface of the heatsink, and a second fight emitting diode being supported by the second surface of theheat sink structure and being eieotricaiiy connected to the circuit board, thesecond fight emitting diode being positioned between the housing abutting edgeof the heat sink structure and the circuit board, wherein the circuit board and the 24 second tight emitting diode each iie in substantiaiiy the same piane as thesecond surtace ct the heat sink structure and do not overiap.
    [21] 21. The headiamp assernbiy of ciaim 20, wherein the heat sänk structure is rernovaoiy attached to the housing.
    [22] 22. The headiamc assembly oi ciaim 21, wherein the housing aoutting edge otthe heat sinit structure inciudes aiignrnent rihs ocsitioned thereon for taciiitatingthe attachment of the heat sink structure to the housing.
    [23] 23. The headiarnp assembiy ct ciaim 2G wherein the headiamp assernbiy isadapted to ernit a high heam and a iow beam, wherein iiiuminaticn ct the tirsttight ernitting diocie resuits in a iow hearn, and wherein iiiumination of hcth thefirst tight ernitting diode and the second tight emitting dicde resuits in a highheam.
    [24] 24. The headiamc assemoiy ot ctairn 20 wherein the heat sink structure is made oi a rnateriai for faciiitating thermai emissivity.
    [25] 25. The headiarnc assernoiy ot ciaim 24 wherein the heat sink structure is made of anodized stack die-east aiurninurn.
    [26] 26. The headiarnp assemoiy of ciairn 20 wherein the first and second tighternitting diode receiving portions inciude aiignment posts formed therein torpositioning the tirst and second tight emitting diodes.
    [27] 27. The headiamc assernbiy ot ctairn 26 wherein the first and second tighternitting diodes are further Secured to the heat sink structure with tasteners.
    [28] 28. The headiamp assemoiy of ciairn 25 wherein a thermaiiy conductivecomoound is cositicned between the heat sink structure and the first tight 2,5 emitting diode and betvveen the heat sänk structure and the second iight emittingdiode.
    [29] 29. The headiarnp assembly of ciairn 25 further comprising a combined BUSSbar and fight biinder assembly positioned en the first side of the heat sänkstructure for eiectrioaliy connecting the circuit board to the first light emittingdiode and for bfocidng a portion of light from the first fight emitting diode.
    [30] 30. The headiamp assembly of claim 29 wherein the combined BUSS bar andfight biinder assembly is over-moided with glass filled nylon.
    [31] 31. The headiamp assembly of claim ZQ wherein the combined BUSS bar andfight biinder biocks fight from "iufiti to 90°U in photometrio pattern.
    [32] 32. A heat sink structure for use in a headiamp assembly with a housing, arefieotor, a circuit board and first and second fight emitting diodes, the heat sink structure comprising: a planer heat sink body having a first surface, a second surface, a housingabutting edge and a substantiaily straight edge, the housing abutting edge beingadapted to abut an inner surface of the housing; a first surface of the pianar body having a first light emitting diodereceiving portion formed therein to support the first fight emitting diode in a samepiane as the first surface; a second pianar surface of the planer body having a second light ernittingdiode receiving portion and a circuit board receiving portion formed tnerein, thecircuit board receiving portion being positioned near the substantialiy straightedge of the heat sink and the light emitting diode receiving portion beingpositiened near the housing abutting edge of the heat sink structure, wherein thesecond light emitting diode receiving portion and a circuit board receiving portion 26 are adapted to support the second fight ernitting diode and the circuit board in asarne pfane as the second surface; andwherein the heat sink is adapted to cornpieteiy bisect the housing into first and second sections.
    [33] 33. The heat sihk structure of ciairn 32, wherein the housing abutting edge oi thepianar body inciudes afignrnent ribs positioned thereon for iaciiitating theattachment of the heat sink structure to the housing.
    [34] 34. The heat sinit structure oi ciairn 32 wherein the heat sink structure is madeof anodized ioiack die-east afuminurri to faciiitate therrnai emissivity.
    [35] 35. The heat sinit structure of cfaim 32 wherein the first and second fight erriittingdiode receiving portions inciude aiignment posts formed therein for positioningthe first and second Eight emitting diodes.
    [36] 36. The heat sink structure of cfairh 35 wherein the first and second fight emittingdiode receiving portions include apertures for receiving fasteners for furthersecuring the first and second fight ernitting diodes.
    [37] 37. A headiamp assernbiy for a vehicie, comprising: a housing for counting the headiainp assentbiy to a vehicie, the housinginciuding an inner surface defined by a refiector; a pianar heat sink structure having a first surface, a second surface, ahousing abutting edge and a substantiaiiy straight edge, the housing abuttingedge being adapted to abut ah inner surface of the housing such that the housingis compieteiy bisected into first and second sections by the pianar heat sinitstructure; a circuit board supported by the second surface of the heat sink, the circuit board inciuding a cut out portion formed therein; 27 a first fight ernitting dicde being supported by the first surface of the heatsink structure and being efectrioaiiy connected to the cirouit board, the first fightemitting diode fying in substantiafiy the same piano as the first surface of the heatsink, and a second fight emitting diode being supported by the second surface of theheat sink structure and being efectricaffy connected to the circuft board, thesecond fight entitting diode being positioned in the cut out portion of the circuitboard such that the circuit board surrounds the second fight ernitting diode,wherein the circuit board and the second fight ernitting diode iie in substantiaiiythe same piano as the second surface of the heat sink structure.
    [38] 38. The headiarno assernbiy of cfairn 37, wherein the heat sänk structure isremovabiy attached to the housing.
    [39] 39. The headiarno assembly of cfaim 38, wherein the housing abutting edge ofthe heat sink structure inciudes afignment ribs positioned thereon for faciiitatingthe attachment of the heat sink structure to the housing.
    [40] 40. The headfamo assernbiy of ciairn S wherein the headiarnp assembfy isadapted to entit a high beam and a iow beam, wherein iifuntihation of the firstfight emitting diode resuits in a icw bearri, and wherein ifiumination of both thefirst fight ernitting diode and the second fight ernitting diode results in a high beam.
    [41] 41. The headiarnp assembiy of ciairn 37 wherein the heat sink structure is madeof anodized biacir die-east afuminurn to faciiitate therrnai ernissivity.
    [42] 42. The headianip assenibiy of ciairn 37 wherein the first and second fight ernitting diode receiving portions inciude afignment posts formed therein forpositioning the first and second tight ernitting diodes on the heat sink structure. 28
    [43] 43. The headlamp assembly of ciaim 42 wherein the first and second lightemitting diodes are further secured to the heat sinit structure with fasteners.
    [44] 44. The headiamp assembiy of claim 3 wherein a thermaiiy conductivecompound is positioned between the heat sinit structure and the first lighternitting ciiode and betiiveen the heat sänk structure and the second light emittingdiode.
    [45] 45. The headtamp assembly of ciaim 37 further comprising a combined BUSSbar and tight biinder assembly positioned on the first side of the heat sinkstructure for eiectricaily connecting the circuit board to the first light emittingdiode and for biocking a portion of iight from the first light emitting diode.
    [46] 46. The headiamp assernbiy of ciaim 45 wherein the combined BUSS bar andlight biinder assembly is over-moided with glass iiiled nylon.
    [47] 47. The headiamp assembiy of ciaim 45 wherein the combined BUSS bar andtight biinder blocks tight from 'f0°t.l to 9u°U in photornetric pattern.
    [48] 48. A heat sinit structure for use in a headlamp assembly with a housing, arefieotor, a circuit board and first and second light ernitting diodes, the heat sänk structure comprising: a planer body having a first surface, a second surface, a housing abuttingedge and a substantiaiiy straight edge, the housing abutting edge being adaptedto abut an inner surface of the housing such that the housing is completelybisected into first and second sections by the planer body; a first surface of the pianar body having a first tight emitting diodereceiving portion formed therein to support the first light ernitting diode in a same piane as the first surface; 29 a second pianar surface of the pianar body having a second Eight emittingdiode receiving portion and a circuit board receiving portion formed therein, thecircuit board receiving portion being formed around the second fight ernittingdiode receiying portion such that the second pianar surface is adapted to hoid acircuit board having a cut out portion formed therein for receiving the second tight emitting diode.
    [49] 49. The heat sink structure of ciairn 48, wherein the housing abutting edge of thepianar body inoiudes aiignrnent ribs positioned thereon for faciiitating theattachment of the pianar body structure to the housing. 5G.
    [50] 50. The heat sinit structure of oiaim 48 wherein the heat sink structure is madeof anodized biack die-east aiuminum to faciiitate thermai emissivity. St.
    [51] 51. The heat sink structure of ciaim 48 wherein the first and second Eight ernittingdiode receiving portions inciude aiignrnent posts formed therein for positioning the first and second tight ernitting diodes.
    [52] 52. The heat sink structure of ciaim 51 wherein the first and second Eight emittingdiode receiving portions inciude apertures for reoeiving fasteners for furthersecuring the first and second tight emitting diodes.
    [53] 53. A headiarnp assembiy for a vehicie, comprisihg: a housing for coupiing the headiamp assembiy to a vehicie, the housinginciuding a refiector; a pianar heat sink structure having a first surface and a second surface,the pianar heat sink being rernovabiy coupied to the housing; a circuit board supported by the heat sink; a first tight ernitting diode assembly supported by the first surface of theheat sink structure and a second tight emitting diode assernbiy supported by the St) second surface of the heat sänk structure, each light emitting diode assemblybeing eiectricaiiy connected to the cirouit board; and wherein the headtamp assembiy is adapted to emit a low beam when oneof the first or second light emitting diode assernbiies is activated and adapted toemit a high bearn when both of the first and second light ernitting diodeassembiies are activated.
    [54] 54. The headiamp assembly of oiaim 53, wherein the heat sink structure includesa housing abutting edge and a substantialiy straight edge, the housing abuttirigedge being adapted to abut an inner surface of the housing such that the housingis completely bisected into first and second sections by the planer heat sink SÉFUCÉU fê.
    [55] 55. The headiamp assembly of ciaim 54, wherein the housing abutting edge ofthe heat sink structure includes aiignment ribs positloned thereon for faciiitatingthe attachment of the heat sänk structure to the housing.
    [56] 56. The headiarnp assembly of ciaim 53 wherein the first surface of the heat sinkstructure inciudes a Eight emitting diode receiving portion formed therein tosupport the first tight emitting diode assembiy in a same piane as the first surface.
    [57] 57. The headiarnp assembly of ciaim 56, wherein the second planer surface ofthe heat sink structure includes a second light emitting diode reoeiving portionformed therein and a oircuit board receiving portion formed therein to support thesecond light emitting diode assembly and the oircuit board in a same piane as the second surface.
    [58] 58. The headlamp assembly of claim 53 wherein the heat sink structure is madeof anodized black die-east aiurninum to facilitate therrnai emissivity. 31
    [59] 59. The headiamo assembly of ciaim 57 wherein the first and second lightemitting diode receiving portions include aiignment posts formed therein forpositioning the light emitting diode assembly.
    [60] 60. The headiarnp assembly of claim 59 wherein the first and second lighternitting diode assemblies are further secured to the heat sink structure with fasteners. St.
    [61] 61. The headiarnp assembly of oiaim 53 wherein a thermaiiy conductivecornpound is positioned between the heat sink structure and the first lightemitting diode assembly and betvveen the heat sink structure and the second light emitting diode assembly. o2.
    [62] 62. The headiamp assembly of oiaim 53 further comprising a combined BUSSbar and light biinder assembly positioned on the first side of the planer heat sinkfor eiectricaliy connecting the circuit board to the first light emitting diodeassembly and for biocking a portion of light from the first light ernitting diodeassembly.
    [63] 63. The headlamo assembly of ciairn dä wherein the combined BUSS bar andlight blinder assembly is over-rrloided with glass filled nylon.
    [64] 64. The headiamp assembly of claim 63 wherein the combined BUSS bar andlight biinder blocks light from fO°U to 90°U in photometric pattern.
    [65] 65. A headlamp for a vehicle comprising: a seven-inch round headiamp housing for ooupiing the headlarnpassembly to a vehicle, the housing including a refiector;a pianar heat sänk structure having a first surface and a second surface, a housing abutting edge and a substantialiy straight edge, the housing abutting 32 edge being adapted to abut an inner surface of the housing, the planer heat sinkbeing removabiy coupled to the housing; a circuit board supported by the heat sink; at least one light emitting diode supported by the first surface of the heatsink structure and at least one light emitting diode supported by the secondsurface of the heat sink structure, each light emitting diode being eiectricailyconnected to the circuit board; and wherein the headlamp assembly is adapted to ernit a high beam and a lowbeam and wherein the headlarnp assembiy is completely bisected by the ptanar heat sink structure.
    [66] 66. 56. The headiamp assembly of oiaim 65, wherein the housing abutting edge ofthe heat sink structure includes aiignrnent ribs positioned thereon for faoiiitatingthe attachment of the heat sink structure to the housing.
    [67] 67. The headiarnp assembiy of ciaim 65 wherein the first surface of the heat sinkstructure includes a tight ernitting diode receiving portion formed therein tosupport the first fight emitting diode assembly in a same piane as the first surface.
    [68] 68. The headlamp assembiy of ciairn 57, wherein the second planar surface ofthe heat sink structure includes a second tight ernitting diode receiving portionformed therein and a oircuit board receiving portion formed therein to support thesecond light emitting diode assembly and the oircuit board, the circuit boardbeing positioned near the substantiaiiy straight edge of the heat sink and, thesecond light emitting diode being positioned betvveen the housing abutting edgeof the heat sink structure and the circuit board, wherein the circuit board and thesecond tight emitting diode each tie in substantially the same piano as thesecond surface of the heat sink structure and do not overlap. 33 os.
    [69] 69. The headianip assembiy ot ciairn 65 wherein the heat sini< structure is madeoi anodized biack die-east aiuntinum to facilitate therrnai emissivity.
    [70] 70. The headiarno assernbiy oi ciaim 68 wherein the first and second tighternitting diode reoeiving portions inciude aiignrnent posts iorrned therein foroositioning the tight ernitting diode assernbiy on the heat sink structure. Ti.
    [71] 71. The headiamo assembiy ot ciairn Tu wherein the first and second tighternitting diode assembties are further secured to the heat sink structure with iasteners. ' 2.
    [72] 72. The headiarno assentbiy ot ciaim 55 wherein a thermaiiy conductivecornpound is positioned between the heat sink structure and the iirst tighternitting diode assembiy and betiiireen the heat sink structure and the second tight ernitting diode assembiy.
    [73] 73. The headiarnp assembty of ciairn 68 further cornorising a combined BUSSbar and tight biinder assentbiy oositioned on the first side oi the oianar heat sinktor eiectricaiiy connecting the circuit board to the iirst iight emitting diodeassentbiy and for biocking a portion oi tight irom the first tight emitting diode assembiy. Te.
    [74] 74. The headiarnp assembly oi ciaim TS wherein the combined BUSS bar andtight biinder assentbiy is over-moided with giass tiiied nyton.
    [75] 75. The headiamo assenibiy oi ciaim 73 wherein the combined BUSS bar andiight biinder biocks tight irorn 10%) to 90% in photonietric pattern. To.
    [76] 76. A headiarnp for a vehicie cornprising: a rectanguiar headiarnp housing tor coupiing the headiarnp assernbiy to avehicie, the housing inciuding a retiector; 34 a ptanar heat sink structure having a tirst surtace and a second surface, ahousing abutting edge and a substantiatty straight edge, the housing abuttingedge being adapted to abut an inner suriace ot the housing, the pianar heat sinkbeing removabiy coupied to the housing; a circuit board supported by the heat sink; at ieast one tight emitting diode supported by the tirst surface ot the heatsink structure and at teast one Eight ernitting diode supported by the secondsurtace ot the heat sink structure, each tight entitting diode being etectricaity connected to the circuit board; andwherein the headiamp assernbiy is adapted to emit a high bearn and a tow beam and wherein the headtamp assembty is compteteiy bisected by the ptanar heat sink structure.
    [77] 77. The headianrp assernbiy ot ciaim 76, wherein the housing abutting edge otthe heat sink structure includes atignrnent ribs positioned thereon tor tacititatingthe attachment ot the heat sink structure to the housing.
    [78] 78. The headtamp assembiy ot ciaim 76 wherein the tirst surface ot the heat sinkstructure inciudes a tight ernitting diode receiving portion formed therein tosupport the first tight emitting diode assentbty in a same piane as the tirst surface.
    [79] 79. The headtarrrp assernbiy ot ciairn 78, wherein the second ptanar surface otthe heat sink structure inctudes a second tight errritting diode receiving portionformed therein and a Circuit board receiving portion formed therein to support thesecond tight ernitting diode assentbiy and the circuit board, the circuit boardreceiving portion being formed around the second tight ernitting diode receivingportion such that the second pianar surtace is adapted to hold a circuit boardhaving a out out portion torrned therein tor receiving the second tight ernittingdiode.
    [80] 80. The headiarnp assembly of cfaim 76 wherein the heat sänk structure is madeof anodized biack die-east afumínurn to facilitate thermat emissivíty.
    [81] 81. The headiarnp assembly of ciairh 79 wherein the first and second fightemittíng oiode receivíhg portions ihcfuee aiignrnent posts formed therein forpositíoning the fight emitting oiode assembiy on the heat sänk structure.
    [82] 82. The headtamc assembiy of ciairn 81 wherein the first and second Eightemittihg oiode assembiíes are further Secured to the heat sänk structure with fasteners.
    [83] 83. The headiamp assembly of cfaim 'Ye whereirt a thermatfy conouctivecompound Es positioned between the heat sänk structure and the first Eightemitting oiode assembiy and between the heat sänk structure ancf the secondEight emitting ofode assembfy. 36
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    JP5889978B1|2016-03-22|LIGHT EMITTING UNIT FOR LIGHTING DEVICE AND LIGHTING DEVICE
    CN102720971A|2012-10-10|Lighting device
    JP2017016955A|2017-01-19|Led lighting fixture
    同族专利:
    公开号 | 公开日
    AU2015238914A1|2015-10-29|
    EP2673165A1|2013-12-18|
    WO2012145056A1|2012-10-26|
    EP2673165A4|2014-07-30|
    EP3260327A1|2017-12-27|
    AU2012246705B2|2015-07-09|
    SE1351031A1|2013-11-08|
    MX2013009225A|2014-05-28|
    AU2012246705A1|2013-09-19|
    ES2644278T3|2017-11-28|
    CA2861948A1|2013-10-26|
    AU2015238914B2|2017-02-02|
    US9638388B2|2017-05-02|
    US20120201043A1|2012-08-09|
    EP2673165B1|2017-07-19|
    USD712079S1|2014-08-26|
    US8845161B2|2014-09-30|
    USD709226S1|2014-07-15|
    US20140369062A1|2014-12-18|
    AU2012246705A8|2013-10-03|
    CA2861948C|2017-08-01|
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    法律状态:
    2020-09-29| NUG| Patent has lapsed|
    优先权:
    申请号 | 申请日 | 专利标题
    US13/024,320|US8845161B2|2011-02-09|2011-02-09|Headlamp assembly with heat sink structure|
    PCT/US2012/024484|WO2012145056A1|2011-02-09|2012-02-09|Headlamp assembly with planar heat sink structure|
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